Silicon wafer is a high-purity doped silicon, which like a "wafer cake" after sliced, polished and cleaned from a doped silicon rod called "ingot" through a series of manufacturing processes. General Processes

The process of manufacturing an ingot is dominated by a technique called Czochralski (CZ) method [Other method available - Float Zone (FZ)]. The final end product of this method is called an ingot, which is in solid cylinder form. After the wafering process, all wafers are in rounded form.

Two different types of silicon are available in the market. They are either the "p" or "n" type depends on the dopant introduced during the ingot pulling process.

Silicon wafer is mainly used for making integrated circuit (IC) chip such as microprocessors, memory devices, diodes, transistors specific IC application. A small portion for sensor or detector manufacturing.